Highlights

Plate fin, pin fin, TPMS or graded lattice block, or an imported STL or 3MF
Conduction in the metal coupled to temperature-dependent convection and radiation
Channel correlation captures the fin-pitch optimum, where more fins start to choke the flow
Base temperature rise, thermal resistance at the solved power, and temperature on the surface
Lists what the model does not know with every result; save inputs on your computer or cloud

A question it answers

How much heat can this sink dump in still air, and what fin pitch should I actually use?

What you put in

Geometry type and dimensions (base length, width and plate thickness; fin height, thickness and pitch; pin diameter and array; lattice cell size and wall thickness; or an imported mesh with an explicit UNIT and up-axis declaration); material and surface emissivity; ambient air temperature and radiant sky temperature; orientation; element budget; and the duty as either a power into the base or a prescribed base temperature. A measured convection coefficient can be entered to override the correlation.

What you get

Base temperature rise, hottest point, thermal resistance quoted at the power it was solved at, convection and radiation split, surface efficiency, mass, wetted area with a breakdown per surface class, temperature and film-coefficient fields painted on the surface, energy balance residual, achieved mesh statistics, and a closed-form optimum fin spacing evaluated for the temperature rise actually reached. A standing section listing what this model does not know is shown with every result.